Product Feature：
1. This product is used for precision grinding and polishing with high removal accuracy;
2. The sample is vacuum adsorbed, and the sample plate can be used for grinding and polishing 4-inch (LAP-200U: 6-inch) wafers;
3. The sample tilt angle can be adjusted;
4. The sample is gravity-pressurized, and the loading force is continuously adjustable;
5. The sample swings left and right to achieve semi-automatic grinding and polishing;
6. The swing speed of the swing arm is even and adjustable;
7. The swing range of the swing arm is adjustable from 0 to 15 degrees;
8. Adopt independent 1KW high -power motor with large torque. No matter the speed is fast or slow, the torque is large and constant.
9. The grinding and polishing disc has a wide range of speeds, from 5 rpm to 100 rpm ;
10. Full touch screen interface, easy to set grinding and polishing parameters;
11. All grinding and polishing parameters such as rotation speed, grinding and polishing time, rotation direction, etc. are automatically saved and easily called up;
12. Connect and control the droppers of four stations with different abrasives;
